——The cornerstone of high-precision and high stability chip manufacturing

1、 Core of the plan

The semiconductor lithography machine base, as the core carrier component of chip manufacturing, needs to have extremely high rigidity, thermal stability, and vibration isolation performance. This scheme uses natural granite and synthetic stone materials, combined with precision machining technology and intelligent vibration isolation technology, to provide stable support for the EUV/ArF lithography machine, ensuring nanometer level lithography accuracy and helping to improve chip yield and production efficiency.

2、 Material selection and performance advantages

1. Natural granite (Jinan Green/Mount Taishan Green)

• Physical properties: hardness HS70-80, compressive strength 245-254N/mm ², coefficient of thermal expansion 8 × 10 ⁻⁶/℃ (only 1/3 of cast iron);

Chemical characteristics: Water absorption rate<0.13%, excellent corrosion resistance, suitable for cleanroom environment;

Application scenarios: EUV lithography machines, high-precision detection equipment bases.

3、 Manufacturing process and structural design

1. Precision machining technology

Numerical Control Grinding: Flatness up to 0.005mm/m (Class 00), surface roughness Ra ≤ 0.2 μ m;

Ultrasonic assisted machining: reduces brittle material edge breakage, with hole accuracy of ± 0.02mm;

Reserved hydraulic oil circuit and sensor installation positions, suitable for optical path calibration and real-time monitoring of lithography machines.

4、 Quality Control and Testing Standards

1. Full process inspection

• Dimensional accuracy: Three coordinate measurement (± 0.01mm/m), laser interferometer calibration for flatness;

Rigid testing: Load to 120% of the design load, with a deformation of ≤ 5 μ m (EUV grade requirement ≤ 3 μ m).

2. Environmental adaptability verification

• Temperature variation test: Under 24-hour ± 1 ℃ fluctuation, the deformation is less than 0.01mm;

Vibration response analysis: Modal frequency>200Hz, avoid resonance with the lithography machine.

5、 Typical application scenarios

1. EUV lithography machine base

• Plan: Natural granite base+three-level vibration isolation system;

Effect: Vibration transmission rate<8%, supporting 300mm wafer exposure accuracy ± 100nm;

Case: TSMC's 5nm production line uses this solution, resulting in a yield rate of over 90%.

2. Panel exposure machine base

• Solution: Synthetic stone base+air spring vibration isolation;

Effect: The deviation of circuit patterns has been reduced from ± 5 μ m to ± 1 μ m, resulting in a 30% increase in production capacity;

——The constancy of stone, the refinement of casting core——

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